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ELECTRICAL CHARACTERISTICS (T A = 25°C unless otherwise noted)
Symbol
Parameter
Conditions
Min
Typ
Max
Units
OFF CHARACTERISTICS
I D = -250 μA, Referenced to 25 C
BV DSS
? BV DSS / ? T J
I DSS
I GSSF
I GSSR
Drain-Source Breakdown Voltage
Breakdown Voltage Temp. Coefficient
Zero Gate Voltage Drain Current
Gate - Body Leakage, Forward
Gate - Body Leakage, Reverse
V GS = 0 V, I D = -250 μA
V DS = -24 V, V GS = 0 V
V GS = 20 V, V DS = 0 V
V GS = -20 V, V DS = 0 V
o
T J = 55 o C
-30
-22
-1
-10
100
-100
V
mV/ o C
μA
μA
nA
nA
ON CHARACTERISTICS (Note 2)
V GS(th)
? V GS(th) / ? T J
R DS(ON)
Gate Threshold Voltage
Gate Threshold VoltageTemp.Coefficient
Static Drain-Source On-Resistance
V DS = V GS , I D = -250 μA
I D = -250 μA, Referenced to 25 o C
V GS = -10 V, I D = -4.0 A
-1
-1.7
4.1
0.041
-3
0.05
V
mV/ o C
?
T J = 125 C
V GS = -4.5 V, I D = -3.4 A
o
0.058
0.06
0.08
0.075
I D(on)
g FS
On-State Drain Current
Forward Transconductance
V GS = -10 V, V DS = -5 V
V DS = -5V, I D = -4 A
-20
9
A
S
DYNAMIC CHARACTERISTICS
C iss
C oss
C rss
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
V DS = -15 V, V GS = 0 V,
f = 1.0 MHz
750
220
100
pF
pF
pF
SWITCHING CHARACTERISTICS (Note 2)
t D(on)
t r
t D(off)
t f
Q g
Q gs
Q gd
Turn - On Delay Time
Turn - On Rise Time
Turn - Off Delay Time
Turn - Off Fall Time
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
V DD = -15 V, I D = -1 A,
V GS = -10 V, R GEN = 6 ?
V DS = -15 V, I D = -4.0 A,
V GS = -5 V
12
14
24
16
8
1.8
3
22
25
38
27
12
ns
ns
ns
ns
nC
nC
nC
DRAIN-SOURCE DIODE CHARACTERISTICS
I S
Continuous Source Diode Current
-1.3
A
V SD
Drain-Source Diode Forward Voltage
V GS = 0 V, I S = -1.3 A
(Note 2)
-0.76
-1.2
V
Notes:
1. R θ JA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the drain pins. R θ JC is guaranteed
by design while R θ CA is determined by the user's board design.
a. 78 o C/W when mounted on a 1 in 2 pad of 2oz Cu on FR-4 board.
b. 156 o C/W when mounted on a minimum pad of 2oz Cu on FR-4 board.
2. Pulse Test: Pulse Width < 300μs, Duty Cycle < 2.0%.
FDC658P Rev.C
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